{"process": "Sputtering", "process_types": [{"abbreviation": "MPS", "description": "Physical Sputtering"}, {"abbreviation": "MSP", "description": "Sputtering"}], "surface": "Cu", "surface_phase": "pc", "species": {"text": "Cu+", "charge": 1}, "temperature": 300, "comment": "Eckstein equation (2) is incorrect; use formula given on p.18 of APID-7B", "refs": [{"id": 144, "authors": "W. Eckstein", "title": "Sputtering Yields. In: Sputtering by Particle Bombardment", "journal": "Topics in Applied Physics", "volume": "110", "page_start": "", "page_end": "", "article_number": "", "year": 2007, "note": "Springer, Berlin, Heidelberg", "doi": "https://doi.org/10.1007/978-3-540-44502-9_3", "bibcode": "", "url": ""}]}
------------------------------------------------------------------------
Sputtering of Cu+ on Cu(pc) at 300 K
{"fit_function": "SPTEEX", "coeffs": {"lambda": 2.604, "q": 14.55, "mu": 2.558, "epsilonL": 4.452e-06, "Eth": 10.78}, "E_min": 10.78, "E_max": 100000}
angle = 0.0 deg
E /eV	P	
10.78	0.0	
12.99	3.443e-06	
15.65	3.134e-05	
18.86	0.0001377	
22.72	0.0004504	
27.38	0.001256	
32.99	0.003169	
39.75	0.007448	
47.89	0.01654	
57.71	0.03489	
69.54	0.06959	
83.79	0.1298	
101.0	0.2231	
121.7	0.3493	
146.6	0.4977	
176.6	0.653	
212.8	0.8045	
256.4	0.949	
309.0	1.088	
372.3	1.226	
448.6	1.365	
540.6	1.509	
651.4	1.658	
784.9	1.815	
945.8	1.979	
1140.0	2.151	
1373.0	2.331	
1655.0	2.518	
1994.0	2.712	
2402.0	2.912	
2895.0	3.117	
3488.0	3.326	
4203.0	3.537	
5064.0	3.749	
6102.0	3.961	
7353.0	4.17	
8859.0	4.375	
10680.0	4.574	
12860.0	4.764	
15500.0	4.944	
18680.0	5.11	
22500.0	5.26	
27120.0	5.392	
32670.0	5.503	
39370.0	5.59	
47440.0	5.652	
57160.0	5.684	
68880.0	5.686	
82990.0	5.656	
-----