{"process": "Sputtering", "process_types": [{"abbreviation": "MPS", "description": "Physical Sputtering"}, {"abbreviation": "MSP", "description": "Sputtering"}], "surface": "Cu", "surface_phase": "pc", "species": {"text": "T+", "charge": 1}, "temperature": 300, "comment": "Eckstein equation (2) is incorrect; use formula given on p.18 of APID-7B", "refs": [{"id": 144, "authors": "W. Eckstein", "title": "Sputtering Yields. In: Sputtering by Particle Bombardment", "journal": "Topics in Applied Physics", "volume": "110", "page_start": "", "page_end": "", "article_number": "", "year": 2007, "note": "Springer, Berlin, Heidelberg", "doi": "https://doi.org/10.1007/978-3-540-44502-9_3", "bibcode": "", "url": ""}]}
------------------------------------------------------------------------
Sputtering of T+ on Cu(pc) at 300 K
{"fit_function": "SPTEEX", "coeffs": {"lambda": 0.2904, "q": 0.2899, "mu": 1.965, "epsilonL": 0.0003315, "Eth": 24.29}, "E_min": 24.29, "E_max": 100000}
angle = 0.0 deg
E /eV	P	
24.29	0.0	
28.79	0.0002108	
34.12	0.001141	
40.43	0.003453	
47.92	0.008038	
56.79	0.01572	
67.3	0.02664	
79.76	0.03978	
94.53	0.05331	
112.0	0.0656	
132.8	0.07588	
157.3	0.08413	
186.5	0.0907	
221.0	0.09596	
261.9	0.1003	
310.4	0.1038	
367.9	0.1067	
436.0	0.109	
516.7	0.1109	
612.3	0.1122	
725.7	0.113	
860.0	0.1133	
1019.0	0.113	
1208.0	0.1122	
1432.0	0.1108	
1697.0	0.1089	
2011.0	0.1064	
2383.0	0.1034	
2824.0	0.09986	
3347.0	0.09592	
3967.0	0.09161	
4701.0	0.08699	
5571.0	0.08214	
6603.0	0.07713	
7825.0	0.07204	
9274.0	0.06694	
10990.0	0.06189	
13030.0	0.05695	
15440.0	0.05217	
18290.0	0.04759	
21680.0	0.04324	
25700.0	0.03914	
30450.0	0.03531	
36090.0	0.03175	
42770.0	0.02846	
50690.0	0.02543	
60080.0	0.02267	
71200.0	0.02016	
84380.0	0.01789	
-----