{"process": "Sputtering", "process_types": [{"abbreviation": "MPS", "description": "Physical Sputtering"}, {"abbreviation": "MSP", "description": "Sputtering"}], "surface": "Cu", "surface_phase": "pc", "species": {"text": "H+", "charge": 1}, "temperature": 300, "comment": "Eckstein equation (2) is incorrect; use formula given on p.18 of APID-7B", "refs": [{"id": 144, "authors": "W. Eckstein", "title": "Sputtering Yields. In: Sputtering by Particle Bombardment", "journal": "Topics in Applied Physics", "volume": "110", "page_start": "", "page_end": "", "article_number": "", "year": 2007, "note": "Springer, Berlin, Heidelberg", "doi": "https://doi.org/10.1007/978-3-540-44502-9_3", "bibcode": "", "url": ""}]}
------------------------------------------------------------------------
Sputtering of H+ on Cu(pc) at 300 K
{"fit_function": "SPTEEX", "coeffs": {"lambda": 0.5015, "q": 0.0566, "mu": 1.991, "epsilonL": 0.0003418, "Eth": 61.72}, "E_min": 61.72, "E_max": 100000}
angle = 0.0 deg
E /eV	P	
61.72	0.0	
71.77	4.498e-05	
83.45	0.0002394	
97.04	0.0007093	
112.8	0.001623	
131.2	0.003146	
152.6	0.005342	
177.4	0.008071	
206.3	0.011	
239.9	0.01374	
278.9	0.01606	
324.3	0.01787	
377.1	0.01924	
438.5	0.02023	
509.9	0.02094	
592.9	0.02143	
689.4	0.02175	
801.6	0.02192	
932.1	0.02198	
1084.0	0.02192	
1260.0	0.02176	
1465.0	0.0215	
1704.0	0.02115	
1981.0	0.02071	
2304.0	0.02019	
2679.0	0.01959	
3115.0	0.01892	
3622.0	0.01819	
4212.0	0.01741	
4898.0	0.01659	
5695.0	0.01574	
6622.0	0.01486	
7700.0	0.01398	
8953.0	0.0131	
10410.0	0.01222	
12110.0	0.01136	
14080.0	0.01052	
16370.0	0.009711	
19030.0	0.008936	
22130.0	0.008197	
25730.0	0.007497	
29920.0	0.006838	
34790.0	0.006222	
40460.0	0.005647	
47040.0	0.005114	
54700.0	0.004621	
63610.0	0.004167	
73960.0	0.003751	
86000.0	0.003371	
-----